And as my brother, Phil, would want to say: it's a fact don't fight it, live with it. Virtually all do, certainly plastic ones, I mean, may be not ceramic particularly the ones that have a complex internal structure and they are not thermally balanced. Well, ladies and gentleman, this is a news flash: BGAs warp during reflow. Would you consider the component to be scrap? What causes the corners of the BGA component to warp and how do we prevent it in the future? Can these components be removed and reused if we remove the warp? The plot gets thicker. This was a new BGA component that had never been installed on a circuit board before. What could be causing this consistent BGA bridging problem?įrom D.W., We recently reworked a BGA component and the corners all bridged. The problem is specific to one corner ball location on one BGA, but it's common to a significant number of circuit assemblies. We are having a problem with BGA components bridging. The next is from A.S., maybe a brother or a sister. We have experimented with many minor adjustments, yet this occasional problem continues. We have been stumped by occasional opens at the corner balls of some BGA components after reflow. hope that's no joke because it's certainly a legitimate question. Phil, there are common themes that show up and I'm going to read three independent questions that were sent on the same topic. But we are here at Board Talk up in Mount Rialto in the Board Talk cave to talk to you today about problems to limit situations and process technique. This is Phil Zarrow and Jim Hall, the Assembly Brothers, who by day, go as mild-mannered consultants for ITM Consulting truth, justice and the American way. He is a pioneer in the science of reflow. He has vast experience in SMT equipment, materials and processes.Ī Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. Process Troubleshooting, Failure Analysis, Process Audits, Process Set-upĬEM Selection/Qualification, SMT Training/Seminars, Legal Disputes Can these components be removed and reused if we remove the warp?īoard Talk Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting. We recently reworked a BGA component and the corners all bridged. To view this video please enable JavaScript, and consider upgrading to a web browser that supports HTML5 video.
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